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  • HFM300 Serisi Isı Akış Ölçer Isıl İletkenlik Test Cihazı
  • HFM300 Serisi Isı Akış Ölçer Isıl İletkenlik Test Cihazı
  • HFM300 Series Heat Flow Meter Thermal Conductivity Test Device
  • HFM300 Series Heat Flow Meter Thermal Conductivity Test Device
  • HFM300 Series Heat Flow Meter Thermal Conductivity Test Device

HFM300 Series Heat Flow Meter Thermal Conductivity Test Device

  • General Information

    ThermCon Scientific’s HFM 300 series thermal conductivity meter is a heat flow meter-based guarded hot plate type thermal conductivity test device, capable of measuring samples with dimensions of 300 x 300 mm and thicknesses ranging from a few millimeters up to 100 mm. This device is primarily used to test the thermal conductivity and thermal resistance of construction materials, insulation materials, glass, fiber, foam, and similar substances. Testable materials include fiberboard, loose-fill glass fiber, rock wool, ceramic fiber, foam plastic (XPS/EPS/PUR, etc.), sandwich composite panels, vacuum panels, cement (concrete) products, glass stone wool, fillers, drywall, and similar materials.

    The HFM 300 measures the thermal conductivity coefficient in compliance with national and international standards, such as GB/T 10295, ISO 8301, JIS B 1412, DIN EN 12667, EN 12939, EN 12664, and ASTM C518 "Standard Specification for Rigid Cellular Polystyrene Thermal Insulation." The device ensures full compliance with national thermal conductivity measurement standards through its stable and precise temperature control technology, computer interface, real-time monitoring and control software, as well as data processing and recording functions.

    Application Areas Thanks to These Advantages Thanks to these advantages, the HFM 300 series is widely used in material properties testing centers, scientific research institutes, factory quality control units, and in the teaching and research activities of higher education institutions.

  • Video

  • Main Features

    • Fully insulated test chamber: A fully insulated test chamber to prevent external influences.
    • Compensation for sample thickness and average temperature: Automatic compensation for samples with different thicknesses and varying temperature conditions.
    • External cooling: Possibility of external cooling using tap water or a circulation chiller for different temperature ranges.
    • Electric plate lifting mechanism: Electrically powered lifting mechanism for easy sample placement.
    • Automatic sample thickness measurement: The device can automatically measure the sample thickness.
    • Integrated single-board computer: Equipped with an integrated single-board computer for processing test data.

  • AInterface

    • Connection options: Provides data processing and analysis capability by connecting to an external computer via an RS232 port using thermal conductivity coefficient testing software.

  • Device Components

    Device Components The device consists of a high-precision internally regulated power supply, thermometer, hot plate heater, hot plate main protection system, thermocouple for temperature measurement, cold plate constant temperature water bath, and computer-based test system.

    a. Sample Section Contains the constant temperature device and operates within a temperature range of -30°C to 90°C.

    b. Heating System Comprises a guarded hot plate heater and measurement power heater.

    c. Temperature Measurement System Temperature measurement is performed using a high-precision digital display device. This system ensures measurement accuracy and stability while achieving zero internal compensation.

    d. Power Measurement System Power measurement is performed using constant heating and a digital display. The measurement accuracy is better than 1%.

    e. Computer Test Section Includes communication components and test software. The computer is used to control the device and analyze the data.

  • Data Processing and Output

    a. Test System The test system is based on the guarded hot plate device with certain improvements made to the mathematical model. Measurements are carried out using a computer-based system through the mathematical model.

    b. Method The method involves measuring heat transfer on both sides of the sample under steady-state temperature conditions. Using these measurements, the thermal conductivity coefficient of the sample is calculated.

    c. Formula
    Q: Heat flux through the sample (W/m²)
    d: Sample thickness (m)
    ∆T: Average temperature difference between both sides of the sample (°C)
    The results must have an accuracy of three significant digits after the decimal point.

    d. Sample Preparation Samples must be carefully prepared to ensure result accuracy.

    e. External Power Supply Connection When connecting the external power supply, ensure that the connection is reliable and that the grounding performance is adequate.

  • Technical Specifications

    ModelHFM300AHFM300B  HFM300CHFM600
    Specifications
    Temperature range     0~ 40 ℃ RT~ 100 ℃ ...-20 ~ 90 ℃ -30 ~ 90 ℃
          variablevariablevariablevariable
    Cooling systemexternal water bath external water bathexternal water bathexternal water bath
    Sample size300×300×(5-100)300×300×(5-100)300×300×(5-100)600×600×(5-200)
    (L*W*H, mm)
    Thermal resistance range0.1 ~ 8.0 m2K/W
    Thermal conductivity range0.003 ~2.5W/m K
    Repeatability1%1%1%2%
    Accuracy+ / - 1 ~ 3%
    Temperature0.1℃/0.01℃
    accuracy/resolution
    Data result analysisAutomatic thermal analysis software, Windows 10/8/7 English
    Supply voltage:AC 220V±5%, power: 3.0kw
    Product list:Testing host, Accurate thermostat chiller, Testing software, Communication interface